- Joined
- Feb 14, 2011
- Messages
- 403
- Reaction score
- 3
I have a couple of quick questions:
My first question is about the +5v supply to the SAA7220.
As standard the SAA7220 gets its +5v supply from the main board and this passes through a 33uH inductor just before the chip. When I fitted a dedicated PSU for the SAA7220 I removed this inductor and used it as a convenient way of separating the chip from the normal power supply. It also gave me a nice convenient point to solder the wire carrying my new +5v supply to. Would it be a good idea use the inductor again on the new +5v supply? A brief explanation would be helpful to help me understand the reasoning/implications.
My second question is about the decoupling arrangement for the SAA7220.
As standard the +5v supply is decoupled to ground with 3 different capacitors in parallel:
A 47nF mica,
A 100uf electrolytic (this is now a 220uF Rubycon ZLH as this was part of the Net Audio upgrade kit).
and finally a 33uF Tantalum
(strangely the tant does not appear on the schematic but it's definitely there).
I have also fitted a 47uF Oscon under the chip which is soldered from the power in pin (pin 24) to the ground plane.
My question is, should I just leave the other decoupling caps in situ now that I have the Oscon fitted?
My first question is about the +5v supply to the SAA7220.
As standard the SAA7220 gets its +5v supply from the main board and this passes through a 33uH inductor just before the chip. When I fitted a dedicated PSU for the SAA7220 I removed this inductor and used it as a convenient way of separating the chip from the normal power supply. It also gave me a nice convenient point to solder the wire carrying my new +5v supply to. Would it be a good idea use the inductor again on the new +5v supply? A brief explanation would be helpful to help me understand the reasoning/implications.
My second question is about the decoupling arrangement for the SAA7220.
As standard the +5v supply is decoupled to ground with 3 different capacitors in parallel:
A 47nF mica,
A 100uf electrolytic (this is now a 220uF Rubycon ZLH as this was part of the Net Audio upgrade kit).
and finally a 33uF Tantalum
(strangely the tant does not appear on the schematic but it's definitely there).
I have also fitted a 47uF Oscon under the chip which is soldered from the power in pin (pin 24) to the ground plane.
My question is, should I just leave the other decoupling caps in situ now that I have the Oscon fitted?